Effect of Forming Temperature on Interfacial Bonding and Mechanical Properties of Extrusion‐Shear Processed Cu‐AA6061 Composites

The effect of forming temperature on the interfacial bonding mechanism and mechanical properties of Cu/Al composites is systematically investigated via the extrusion‐shear process. Within the temperature range of 500–560 °C, the interface of Cu/Al composites undergoes a transition from mechanical interlocking to metallurgical bonding. Meanwhile, excessively high temperatures induce the formation of excessive intermetallic compounds (IMCs), leading to the fracture mode of the Cu matrix transforming from quasi‐cleavage fracture to brittle fracture, whereas the Al matrix maintains a ductile fracture mode throughout. Overall, 530 °C is identified as the optimal forming temperature in this study. At this temperature, the formation of excessive IMCs is suppressed, balancing diffusion and ductility. Additionally, the dynamic recrystallization mechanism of aluminum is activated at 530 °C, refining the average grain size to 45.9 μm. In contrast to the Al matrix, copper exhibits dynamic recovery at all three temperatures investigated.