Contact Engineering with Selenium Interlayers for High‐Performance p‐Type Two‐Dimensional WSe 2 Transistors

ABSTRACT The development of high‐performance p‐type 2D transistors is hindered by Fermi level pinning (FLP) caused by the direct deposition of the contact metal on the 2D semiconducting layer, resulting in a Schottky barrier that limits efficient hole injection. In this study, we demonstrate a contact engineering strategy that enhances the p‐type 2D transistor performance by inserting a selenium interlayer (SIL) between the contact metal and transition metal dichalcogenide (TMD). Utilizing the physics of Fermi level pinning, we optimize the Fermi level to deeper levels at the metal‐selenium interface, enhancing hole injection. Through SIL insertion, the average hole field‐effect mobility of WSe 2 transistors increases significantly from 23 to 107 cm 2 V −1 s −1 , and the on‐current density from 8.4 to 55 µA/µm. The on/off current ratio exceeds 10 8 , and the maximum mobility reaches 119 cm 2 V −1 s −1 . The effectiveness of this approach is demonstrated in various p‐type TMD channels, including WSe 2 , WS 2 , and MoSe 2, as well as in various metal electrodes, all of which exhibit enhanced hole injection. This work provides a simple method to enhance the performance of p‐type 2D transistors by improving the hole injection efficiency.