A Dual‐Modal Programmable E‐Skin with Tunable In‐Sensor Touch Computing

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Authors: Yu Zhen Hu, Zijian Huang, Yanhao Luo, Shifan Yu, Hao Chen, Lei Liu, Wansheng Lin, Yuchen Lin, Ziquan Guo, Jianghui Zheng, Yuanjin Zheng, Zhiqi Chen
+1 more Liao Xinqin
Cited by: 1
References: 35

Abstract

ABSTRACT Touch perception endows embodied intelligence with autonomous cognition and decision‐making. However, conventional sensing frameworks based on von Neumann architecture suffer from sensing and computing separation, leading to data redundancy, complex parameter tuning, and limited scalability. Here, a dual‐modal programmable intelligent electronic skin (DPI e‐skin) is proposed unprecedentedly with touch event‐driven in‐sensor computing, enabling efficient position and pressure synchronous recognition. With an expandable multilayer stacking architecture, the DPI e‐skin reconstructed the signal form at the device level, directly outputting continuous position information and gradient pressure classification that matched the cognition scale. It significantly reduced redundant data and maintained high sensing performance with precise position resolution (380 kPa). Moreover, the pressure thresholds of different layers in the DPI e‐skin could be dynamically tuned to support diverse applications, like multi‐degree‐of‐freedom control and a typing system. Benefitting from the synergy of position and pressure, the DPI e‐skin serves as an encryption device to achieve accurate users’ static and dynamic feature cognition with high accuracy (>96%). This study provides an innovative design paradigm for high‐performance and deeply integrated touch perception that promotes the development of interactive intelligence, with the aim of achieving greater efficiency, security, and personalization.

Fields of Study & Subjects

Advanced Sensor and Energy Harvesting Materials Tactile and Sensory Interactions Interactive and Immersive Displays

Publication details

Journal / source
Advanced Functional Materials
Publisher
Wiley
Volume
36
Issue
36
Publication date
29 January 2026
Language
EN