Efficient, Non‐Destructive Transfer of Wafer‐Scale Monolayer MoS 2 by Interface Engineering (Adv. Funct. Mater. 12/2026)

Advanced Functional Materials 2026 Open access

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Authors: Zheng Wei, Yongqing Cai, Jieying Liu, Liyan Zhang, Jiaojiao Zhao, Jian Tang, Lu Li, Qinqin Wang, H J Zhang, Zhihua Zhang, Dongxia Shi, Luojun Du
DOI: 10.1002/adfm.73861
Cited by: 0

Abstract

Interface Engineering This cover image illustrates efficient, non-destructive transfer of wafer-scale monolayer MoS2 through interface engineering. The visual highlights MoS2 on the surface with a magnifying crystal structure, a PDMS interface, and a sapphire substrate. Lifted films reveal weak substrate bonding, offering new insights toward transfer and device application for 2D materials. More information can be found in the Research Article by Zhihua Zhang, Dongxia Shi, Luojun Du, and co-workers (10.1002/adfm.202517643).

Fields of Study & Subjects

2D Materials and Applications Graphene research and applications Advanced Sensor and Energy Harvesting Materials

Publication details

Journal / source
Advanced Functional Materials
Volume
36
Issue
12
Publication date
1 February 2026
Language
EN