Dual‐Component Multilayer Piezoelectric Ceramics with a Central Through‐Hole Interdigitated Architecture for Structural‐Functional Coupling and High‐Performance Accelerometers
Abstract
ABSTRACT Piezoelectric accelerometers are key devices for vibration sensing and structural health monitoring, yet multilayer piezoelectric ceramics (MLPC) has been limited by structural incompatibility. Herein, we innovatively propose a lead‐free potassium sodium niobate (KNN)‐based multilayer piezoelectric ceramic with a through‐hole structure (MLPC‐TH), specifically designed to achieve seamless compatibility with compression‐type accelerometer architectures. The MLPC‐TH element is fabricated via a modified tape‐casting and lamination process, which integrates a tailored internal electrode configuration and postlamination laser drilling. This design not only enhances the performance of the multilayer structure but also resolves the long‐standing mechanical‐electrical coupling mismatch issue. Moreover, a dual‐component composite design leverages the performance complementarity of distinct KNN‐based phases, synergistically realizing the dual enhancement of the effective piezoelectric coefficient ( d 33 ∼ 1914 pC/N) and thermal stability. The accelerometer developed based on MLPC‐TH achieves a high charge sensitivity ( S q ∼ 55 pC/g) with nonlinearity controlled below 1%. Reliability evaluations reveal that the sensor exhibits nearly undiminished sensitivity after over 2 × 10 6 vibration cycles, and maintains stable performance across a wide temperature range of 30–100°C—demonstrating exceptional long‐term operational stability and environmental adaptability. This work establishes a scalable, high‐reliability, and environmentally sustainable strategy for next‐generation vibration sensors.
Fields of Study & Subjects
Ferroelectric and Piezoelectric Materials
Soft Robotics and Applications
Aeroelasticity and Vibration Control
Publication details
- Journal / source
- Advanced Functional Materials
- Publisher
- Wiley
- Volume
- 36
- Issue
- 37
- Publication date
- 12 February 2026
- Language
- EN