A Hierarchically Structured, Stretchable, Anti‐Biofouling Encapsulation for Biodegradable Electronics (Adv. Healthcare Mater. 7/2026)

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Authors: Won Bae Han, Sungkeun Han, Gwan‐Jin Ko, Ulziituya Batjargal, Wonjun Jang, Venkata Ramesh Naganaboina, Han‐Jun Kim, Suk‐Won Hwang
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Abstract

Biodegradable Electronics A soft, stretchable, and anti-biofouling encapsulant integrates self-assembled organosilicon nanowire networks with micropatterned biodegradable elastomers, creating a hierarchical surface that exhibits superhydrophobicity and remarkable improvement in water-barrier performance. This hierarchically structured encapsulant effectively suppresses cell adhesion and fibrotic responses, ensuring prolonged stability and reliable functionality of next-generation transient and bioresorbable electronic implants in physiological environments. More details can be found in the Research Article by Han-Jun Kim, Suk-Won Hwang, and co-workers (DOI: 10.1002/adhm.202503622).

Fields of Study & Subjects

Surface Modification and Superhydrophobicity Advanced Sensor and Energy Harvesting Materials biodegradable polymer synthesis and properties

Publication details

Journal / source
Advanced Healthcare Materials
Volume
15
Issue
7
Publication date
1 February 2026
Language
EN