Direct Growth of Wafer‐Scale 2D Semiconductor Transistors via One‐Step PtTe 2 /2H‐MoTe 2 Heterophase Formation

View at publisher
Authors: Qin Shuai, Qijun Zong, Jiali Yi, Tian Zhang, Huawei Liu, Zheng Wang, Haifeng Wu, Tanghao Xie, Dong Li, Anlian Pan
Cited by: 1
References: 37

Abstract

ABSTRACT 2D semiconductors offer a promising platform for next‐generation integrated circuits and large‐scale electronic systems. Realizing high‐performance p‐type transistors, however, remains challenging due to Fermi‐level pinning, high contact resistance, and poorly defined interfaces in conventional stepwise fabrication. Here, we demonstrate a single‐step tellurization growth strategy that simultaneously forms PtTe 2 contacts on 2H‐MoTe 2 channels to directly realize 2D semiconductor transistors. This approach forms PtTe 2 /2H‐MoTe 2 metal/semiconductor arrays with precise control of the MoTe 2 phase at the PtTe 2 electrode interface, while providing integrated van der Waals metallic contacts without the need for post‐growth of metal contacts. Using this method, we achieve wafer‐scale heterophase arrays characterized by uniform patterning and well‐controlled 2H/1T' phase transformation dynamics. The heterojunctions display sharp and clean interfaces, as verified by TEM, STEM, and EDS mapping. Transistor arrays fabricated from these heterophase structures show Ohmic contacts with low Schottky barrier heights, delivering on/off ratios up to 5 × 10 4 and consistent mobility of 5–9 cm 2 /Vs across 100 devices, ensuring efficient carrier injection. Our results establish a scalable pathway for the direct growth of 2D semiconductor transistors, overcoming conventional multi‐step device fabrication bottlenecks and providing a promising platform for large‐scale, and reproducible 2D electronics.

Fields of Study & Subjects

2D Materials and Applications Topological Materials and Phenomena Graphene research and applications

Publication details

Journal / source
Advanced Materials
Publisher
Wiley
Volume
38
Issue
18
Pages
e22270–e22270
Publication date
28 February 2026
Language
EN