A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics

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Authors: Hao Liu, Masahito Takakuwa, Michitaka Yamamoto, Yue Wang, Tomoyuki Yokota, Takao Someya, Toshihiro Itoh, Seiichi Takamatsu
Cited by: 2
References: 43

Abstract

Reliable soft sensors are essential for precise control, real-time feedback, and safe operation in soft medical robots. Ultrathin silicon piezoresistive sensors offer flexibility, durability, and high sensitivity, but protecting them from external stress while maintaining softness remains challenging. Existing packaging strategies often compromise flexibility and induce excessive strain, leading to device failure. Here, we introduce an oil-lubricated slidable packaging approach that enables high-fidelity shape sensing of ultrathin silicon gauges by mechanically isolating the sensing element within a dual-layer film. This design decouples the sensor from the packaging, minimizing bending strain on the sensing element. Experimental results show that the sensor maintains stable and reliable signals under large applied strains, with fast response (

Fields of Study & Subjects

Advanced Sensor and Energy Harvesting Materials Soft Robotics and Applications Advanced Materials and Mechanics

Publication details

Journal / source
Advanced Science
Publisher
Wiley
Volume
13
Issue
22
Pages
e18733–e18733
Publication date
26 February 2026
Language
EN