Dual‐Modulated Vertically Stacked Transistors With Fully Laminated Plate‐Type Architecture Featuring Nanoscale Channel Length

ABSTRACT A transistor with fully laminated plate‐type triode electrodes, source, drain and gate offers higher current density than a typical transistor design by allowing a 2D current path. Nanoscale transistors face challenges like off‐state leakage, so we introduce a new design using a laminated plate‐type architecture and a dual‐modulation strategy to improve performance and stability. Both top and bottom gates are used as active electrodes to fully control the channel's thickness. A micro‐hole patterned electrode is employed to enable effective gate field penetration into the channel, while a graphene electrode facilitates Fermi‐level modulation and improves field transfer. Furthermore, a leakage blocking layer is inserted to suppress unwanted carrier injection in the source and drain overlap regions. The device achieves low off‐state current of ≈10 −12 A and an on/off‐current ratio exceeding 10 6 at V DS of 3 V. It also delivers high output currents under low‐voltage operation (1 mA cm −2 at 0.1 V and 50 mA cm −2 at 1 V). Despite a nanoscale channel length, the device maintains near‐zero V TH . The fully encapsulated channel shows strong reliability against bias stress and light. This work shows that a laminated vertical design with dual‐gate control effectively enhances the stability of nanoscale transistors, highlighting their potential for next‐generation low‐power logic, memory, and flexible electronics.