Interfacial Synergy in a Band‐Aligned Low‐Dimensional Heterojunction Toward Broadband Photodetection

Read full text
Authors: Yuanfeng Wen, Kening Xiao, Yi Yang, Mengjie Jiang, Libo Zhang, Shicong Hou, Hang Ma, Yunduo Zhang, Wenqi Mo, Yiran Tan, Bolang Peng, Jinqiu Huang
+9 more Xueyuan Wei, Chunming Liu, B I N G Zhao, Jiale He, Q. X. Li, Songyuan Ding, Yi Zhou, Guanhai Li, Xiaoshuang Chen
Cited by: 2
References: 69

Abstract

ABSTRACT Monolithic integration of sensing, imaging, and communication from visible to terahertz bands on a single chip remains challenging as efficient detection across such disparate energies demands stringent, often incompatible material properties. However, conventional semiconductors suffer from intrinsic bandgap limitations or require cryogenic cooling, while existing low‐dimensional heterojunctions often struggle to synergize multiband response kinetics and suppress interfacial carrier recombination. Here, we demonstrate a band‐aligned low‐dimensional heterojunction based on Ta 2 NiSe 5 and Sb 2 Te 3 that leverages interfacial synergy to unify complementary photoresponse pathways, thereby enabling ultrabroadband and low‐noise photodetection spanning across visible to terahertz regimes. The device delivers stable responsivities of up to 0.19 A·W −1 in the visible–near‐infrared regime, while antenna‐enhanced coupling extends detection into the terahertz range with microsecond transients, 10 kHz bandwidth, and a minimum noise‐equivalent power of 26 pW·Hz −1/2 . A built‐in potential of 115 meV, originating from the Type‐II band alignment, plays a dual role by ensuring highly efficient carrier separation in the short‐wavelength band and driving a strong photothermoelectric effect in the terahertz regime. The synergistic interfacial response allows further implementation of reconfigurable logic operations and dual‐channel ASCII data transmission using visible and terahertz signals as independent carriers, highlighting its potential for anti‐jamming communication and multifunctional photonic systems.

Fields of Study & Subjects

2D Materials and Applications Advanced Thermoelectric Materials and Devices Thermal Radiation and Cooling Technologies

Publication details

Journal / source
Advanced Science
Publisher
Wiley
Volume
13
Issue
20
Pages
e20919–e20919
Publication date
26 February 2026
Language
EN