Front Cover: Strategies for Enhancing SiO 2 Chemical‐Mechanical Polishing (CMP): Functional Nanoparticle Abrasive Design and Integration

Chemistry - A European Journal 2026 Open access

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Authors: Hyeonseok Lee, Gyuhyeon Kim, Wooseok Jeong, Yeongbin Lee, Heesoo Jeong, Yujeong Ahn, Chanbi Kim, Don‐Hyung Ha
DOI: 10.1002/chem.70767
Cited by: 1

Abstract

The Front Cover illustrates SiO2 chemical–mechanical polishing, where a rotating pad and slurry deliver nanoparticle abrasives to the surface. The three ceramic nanoparticles in distinct morphologies in the foreground represent the diverse, rapidly evolving abrasive designs developed to improve polishing performance. More information can be found in the Review by D.-H. Ha and co-workers (DOI: 10.1002/chem.202502584).

Fields of Study & Subjects

Advanced Surface Polishing Techniques Nanofabrication and Lithography Techniques Diamond and Carbon-based Materials Research

Publication details

Journal / source
Chemistry - A European Journal
Publisher
Wiley
Volume
32
Issue
7
Publication date
16 February 2026
Language
EN