From hydrogels to eutectogels: Emerging platforms for stretchable electronics

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Authors: Chang Zhou, Jiancheng Dong, Jiayu Hou, Shiyin Lin, Xingyu Liu, Hao Qiu, Mengting Zheng, Yuduo Zhang, Haijun Zhu, Kangjia Geng, Yidong Peng, Haoran Liu
+3 more Xu Zhang, Yinghao Huang, Tianxi Liu
Cited by: 1
References: 186

Abstract

Abstract The transition of wearable electronics from rigid components to skin‐interfaced systems has driven the search for materials that mimic the mechanical compliance of biological tissues. While hydrogels offer tissue‐like softness, their inevitable dehydration limits long‐term stability and functionality. Eutectogels, formed by immobilizing deep eutectic solvents (DESs) within polymer networks, have emerged as a robust alternative that overcomes these volatility issues while retaining intrinsic ionic conductivity and biocompatibility. This review provides a comprehensive roadmap of the eutectogel platform, starting from the fundamental chemistry of DESs to the design strategies for crosslinked polymer architectures. We analyze how specific fabrication methods tailor critical properties such as environmental tolerance, interfacial adhesion, and mechanical resilience. These material attributes enable a diverse range of applications, including high‐sensitivity strain sensing, electrophysiological monitoring, and advanced human‐machine interfaces. Beyond current capabilities, we critically examine the translational challenges facing the field, particularly the trade‐off between ionic conductivity and structural integrity. The discussion extends to emerging opportunities that will define the next generation of eutectogels, specifically the integration of artificial intelligence for data‐driven material discovery and signal interpretation, the adoption of three‐dimensional printing for customized manufacturing, and the development of fully recyclable networks to ensure life‐cycle sustainability.

Fields of Study & Subjects

Advanced Sensor and Energy Harvesting Materials Hydrogels: synthesis properties applications Conducting polymers and applications

Publication details

Journal / source
FlexMat.
Publisher
Wiley
Publication date
16 April 2026
Language
EN