Damage Prediction and Localization of GLARE Laminates Under Tensile Load Using SWCNT / PSF / PI Sensors and DIC Analysis

ABSTRACT In this study, a novel single‐walled carbon nanotubes/polysulfone (PSF)/polyimide (PI) (SPP) sensor was combined with digital image correlation (DIC) analysis to investigate damage prediction and localization methods on different layers of glass laminate aluminum reinforced epoxy (GLARE) laminates under tensile loading. The experimental data obtained from DIC analysis were used to characterize the displacement of GLARE laminates in both the spanwise and chordwise directions. The novel SPP sensors were strategically positioned on GLARE laminates to evaluate the failure mode and degree of damage. The results of the DIC analysis revealed that GLARE laminates exhibit chordwise bending before fiber fracture occurs. Moreover, the responses of the SPP sensors positioned in different layers correlated well with the displacement and failure degree of GLARE laminates, demonstrating their efficiency in predicting and locating failures. These findings significantly contribute to the advancement of structural health monitoring techniques for GLARE laminates.