The Micro‐Nano Hybrid Filler Al 2 O 3 @ CuNPs Is Used to Improve the Thermal Conductivity of Epoxy Resin Composites
Abstract
ABSTRACT In this study, a micro/nano hybrid filler comprised of Al 2 O 3 @CuNPs is synthesized through a chemical reduction method. The incorporation of Cu nanoparticles serves as a bridge, addressing the contact issues within the filler and substantially enhancing its ability to establish a thermal conductivity network. The filler loading was kept at a constant level up to 70 wt%; however, the copper amount was varied between 0 and 10 wt%. The resulting thermal conductivity of the Al 2 O 3 @CuNPs/EP composite exhibits a gradual increase with the filler content, reaching 1.06 W/mK at a total filler content of 70 wt%. This represents a remarkable growth rate of 457.9% compared to pure EP. This material holds promising potential for applications in thermal conductivity materials.
Fields of Study & Subjects
Thermal properties of materials
Aluminum Alloys Composites Properties
Advanced ceramic materials synthesis
Publication details
- Journal / source
- Journal of Polymer Science
- Publisher
- Wiley
- Volume
- 64
- Issue
- 6
- Pages
- 1518–1527
- Publication date
- 11 February 2026
- Language
- EN