Mechanically Robust and Anti‐Biofouling Hybrid Encapsulation via Layered Organic–Liquid Interfaces for Implantable Devices

Implantable bioelectronic devices, due to their prolonged contact with biological tissues, face persistent challenges including moisture permeation, mechanical deformation, and biofouling. Traditional encapsulation strategies using either inorganic or organic materials face trade-offs between moisture barrier performance and mechanical flexibility. Inorganic materials provide excellent moisture resistance but are brittle, whereas organic polymers are flexible but inherently permeable. Here, we developed a Multi-layered Organic-based Liquid Encapsulation (MOLE) specifically tailored for implantable bioelectronics. MOLE consists of a layer-by-layer assembly of amine-functionalized silicone elastomer and Parylene-C, forming chemically bonded and conformal interfaces with enhanced interfacial adhesion. The outermost silicone layer, infused with silicone oil, minimizes protein adsorption (