Engineering of Multiple Heterointerfaces in N, S‐Codoped Hollow Cu/Cu 2 S/C Nanoboxes for Superior Electromagnetic Attenuation

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Authors: Wei Hu, Shihan Fu, Wenbo Liu, Yunpeng Wang, Hongmin Hu, 樊晓成, Yujin Chen, Bei Li
Cited by: 3
References: 57

Abstract

Abstract The reasonable construction of hollow structures featuring multiple heterointerfaces is widely recognized as crucial for developing high‐performance electromagnetic wave (EMW) absorbers, owing to their advantages in lightweight and enhanced interfacial polarization. However, achieving precise structural control and obtaining deep understanding of associated dielectric loss mechanisms still remain challenging. To address this, we rationally designed and synthesized N, S‐codoped hollow Cu/Cu 2 S/C nanoboxes (H‐Cu/Cu 2 S@NSC) through a multi‐step process based on self‐sacrificing templates. This unique architecture ingeniously integrates interior hollow cavities, various heterointerfaces (including Cu/Cu 2 S, Cu/C, and Cu 2 S/C), and heteroatom doping within a single entity. Benefiting from the synergistic effect between hollow structure and heterointerfaces, the H‐Cu/Cu 2 S@NSC maintains lightweight characteristics while exhibiting enhanced interfacial polarization. Furthermore, N, S‐codoped carbon shell further improves conduction loss and dipole polarization. Density functional theory (DFT) calculations provide deep insights into the electronic interactions at the heterointerfaces, confirming promoted charge transfer and polarization effects. As a result, H‐Cu/Cu 2 S@NSC exhibits exceptional EMW absorption performance, with a minimum reflection loss ( RL min ) of ‐62.21 dB at 2.04 mm and a broad effective absorption bandwidth (EAB) of 4.8 GHz at merely 1.64 mm. This work provides a feasible strategy for the rational design of advanced hollow multi‐interface materials for efficient EMW attenuation.

Fields of Study & Subjects

Electromagnetic wave absorption materials Advanced Antenna and Metasurface Technologies MXene and MAX Phase Materials

Publication details

Journal / source
Small
Publisher
Wiley
Volume
22
Issue
33
Pages
e73574–e73574
Publication date
27 April 2026
Language
EN