Front Cover: A Selective Deposition Strategy of Ultrathin Metal Layer on Sub‐Micrometer‐Pitch Cu Interconnection for Low‐Temperature Hybrid Bonding (Small Sci. 2/2026)

Small Science 2026 Open access

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Authors: Zambaga Otgonbayar, Jungchul Noh, Seong‐Ho Yoon, Gyu-Sik Park, Suk Jekal, Jiwon Kim, Jeong‐Hwan Lee, Rino Choi, Jeonghun Kim, Myeongjin Kim, Chang‐Min Yoon
DOI: 10.1002/smsc.70187
Cited by: 0

Fields of Study & Subjects

3D IC and TSV technologies Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies

Publication details

Journal / source
Small Science
Volume
6
Issue
2
Publication date
1 February 2026
Language
EN