Dynamic H‐Bond Networks in TPP Photoresins Enable High‐Strength and Directed Fluid Control

ABSTRACT Two‐photon polymerization (TPP) enables ultrahigh‐resolution 3D printing but faces challenges in mechanical robustness and microfluidic integration. By introducing hydrogen bonds, materials can exhibit high mechanical strength and hydrophilicity. Here, a novel photosensitive resin was reported, termed BUM, engineered by blending a urea‐pyrimidinone‐containing monomer with bisphenol A glycerolate diacrylate. BUM resin has a fracture elongation of 17.5%, a fracture strength of 98.5 MPa, a toughness of 10.3 MJ m − 3 , a modulus of 6.33 GPa, and a hardness of 0.30 GPa, exhibiting high mechanical strength. Its printability across submicron to millimeter scales has been verified through complex structures. Simultaneously, mimicking the properties of biomass materials, a high density of hydrogen bonds was introduced into the photosensitive resin to enhance its performance in hydrophilic environments. By leveraging biomimetic principles in both structural and material design, a pointed cone structure inspired by wheat awns was developed, achieving a reverse gravity unidirectional water transport of 4.17 mm s −1 , which is 6.4% higher than the control group. This synergy of intrinsic material enhancement and structural design unlocks multifunctionality for microfluidics and directed liquid transport. This work demonstrates new application potential for hydrogen bonding engineering resins used in high‐strength, functional microdevices.