A Role of Electromigration at Nanostructuring of Thin Films During Deposition
Fields of Study & Subjects
Copper Interconnects and Reliability
Optical Coatings and Gratings
Theoretical and Computational Physics
Publication details
- Journal / source
- Springer proceedings in physics
- Pages
- 105–122
- Publication date
- 1 January 2026
- Language
- EN