Interconnect

Synthesis lectures on engineering, science, and technology 2026 Book chapter

View at publisher
Authors: Yuan Tu
DOI: 10.1007/978-3-032-04000-8_3
Cited by: 0
References: 17

Fields of Study & Subjects

Copper Interconnects and Reliability 3D IC and TSV technologies Electronic Packaging and Soldering Technologies

Publication details

Journal / source
Synthesis lectures on engineering, science, and technology
Pages
55–89
Publication date
1 January 2026
Language
EN
Document type
Book chapter