Packaging

Synthesis lectures on engineering, science, and technology 2026 Book chapter

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Authors: Yuan Tu
DOI: 10.1007/978-3-032-04000-8_4
Cited by: 0
References: 12

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

Publication details

Journal / source
Synthesis lectures on engineering, science, and technology
Pages
91–125
Publication date
1 January 2026
Language
EN
Document type
Book chapter