Perspective

Synthesis lectures on engineering, science, and technology 2026 Book chapter

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Authors: Yuan Tu
DOI: 10.1007/978-3-032-04000-8_7
Cited by: 0
References: 1

Fields of Study & Subjects

Copper Interconnects and Reliability 3D IC and TSV technologies Nanofabrication and Lithography Techniques

Publication details

Journal / source
Synthesis lectures on engineering, science, and technology
Pages
213–216
Publication date
1 January 2026
Language
EN
Document type
Book chapter