Optimization of Electromagnetic Induction Heating for Adhesive Bonding—A Computational Study on Induction Bonding Process

2026

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Authors: Taha Najam, Suhail Hyder Vattathurvalappil
DOI: 10.1007/978-3-032-05216-2_2
Cited by: 0
References: 14

Fields of Study & Subjects

Induction Heating and Inverter Technology 3D IC and TSV technologies Mechanical Behavior of Composites

Publication details

Pages
17–28
Publication date
1 January 2026
Language
EN