Physics-Based 3D Simulation for Synthetic Data Generation and Failure Analysis in Packaging Stability Assessment

Lecture notes in computer science 2026

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Authors: Samuel Seligardi, Pietro Musoni, Eleonora Iotti, Gianluca Contesso, Alessandro Dal Palù
DOI: 10.1007/978-3-032-10185-3_32
Cited by: 0
References: 14

Fields of Study & Subjects

Material Properties and Processing Electronic Packaging and Soldering Technologies Polymer Science and PVC

Publication details

Journal / source
Lecture notes in computer science
Pages
403–415
Publication date
1 January 2026
Language
EN