Precision High-efficiency Water-Hammer-Driven BGA Solder Ball Placement and Jetting Control Study
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Fluid Dynamics and Heat Transfer
Welding Techniques and Residual Stresses
Publication details
- Journal / source
- Mechanisms and machine science
- Pages
- 236–244
- Publication date
- 1 January 2026
- Language
- EN