Patterning Design of Copper Mesh Film and Its Performances for Transparent Antenna Application

Springer Proceedings in Materials 2026

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Authors: Yi Chun Jin, Yi Che Tsai, Han Chang Pan, Shih Hong Chen
DOI: 10.1007/978-981-95-0445-9_7
Cited by: 0
References: 18

Fields of Study & Subjects

Nanomaterials and Printing Technologies 3D IC and TSV technologies Electronic Packaging and Soldering Technologies

Publication details

Journal / source
Springer Proceedings in Materials
Pages
75–86
Publication date
1 January 2026
Language
EN