Nano-indentation-Induced Crystal Evolution and Dislocation in Copper: An Atomistic Molecular Dynamic Simulation-Based Investigation
Fields of Study & Subjects
Microstructure and mechanical properties
Copper Interconnects and Reliability
Advanced Surface Polishing Techniques
Publication details
- Journal / source
- Springer Proceedings in Materials
- Pages
- 145–154
- Publication date
- 1 January 2026
- Language
- EN