Reliability of Integrated Circuit Board-Level Assembly

Reliability Technology for Integrated Circuit Packaging 2026 Book chapter

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Authors: Bin Zhou, Yunfei En, Si Chen

DOI: 10.1007/978-981-95-3885-0_10

Cited by: 1

References: 28

Fields of Study & Subjects

VLSI and Analog Circuit Testing Electromagnetic Compatibility and Noise Suppression Integrated Circuits and Semiconductor Failure Analysis

References 28