Analysis of the Overload Junction Temperature of the IGBT in a Flexible DC Converter Based on the Electro-Thermal Coupling Model
Fields of Study & Subjects
HVDC Systems and Fault Protection
Silicon Carbide Semiconductor Technologies
Thermal Analysis in Power Transmission
Publication details
- Journal / source
- Lecture notes in electrical engineering
- Pages
- 548–558
- Publication date
- 1 January 2026
- Language
- EN