The Nearside Modification Approach of Thermal Model of Power Module

Lecture notes in electrical engineering 2026

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Authors: Qian Luo, Bin Zhao, Peng Sun, Zhibin Zhao, Yong Chen, Cheng Xu
DOI: 10.1007/978-981-95-4274-1_40
Cited by: 0
References: 7

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Electronic Packaging and Soldering Technologies Thermal properties of materials

Publication details

Journal / source
Lecture notes in electrical engineering
Pages
381–388
Publication date
1 January 2026
Language
EN