Composite Multivariate Function Model of Connector’s Contact Resistance in High-Temperature Environments

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Authors: Shuyan Yang, Xueyan Lin, Yixu Shu
Cited by: 0
References: 5

Fields of Study & Subjects

Electrical Contact Performance and Analysis Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

Publication details

Journal / source
Lecture notes in electrical engineering
Pages
705–712
Publication date
1 January 2026
Language
EN