MEMS–CMOS Co‑design for Ultra‑Low‑Power IoT
Fields of Study & Subjects
Advanced MEMS and NEMS Technologies
3D IC and TSV technologies
Advancements in Semiconductor Devices and Circuit Design
Publication details
- Journal / source
- Lecture notes in electrical engineering
- Pages
- 467–489
- Publication date
- 1 January 2026
- Language
- EN
- Document type
- Book chapter