Low-Inductance Design and Lifetime Prediction of SiC Power Module Based on Cu-Clip

Lecture notes in electrical engineering 2026

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Authors: Shunqi Wang, Kailin Pan, Qingli Mo, Nianbin Cheng

DOI: 10.1007/978-981-95-6322-7_7

Cited by: 0

References: 10

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Electronic Packaging and Soldering Technologies Advanced DC-DC Converters

References 10