Simulation of Optimized Clamper Material and Lead frame Thickness Performance Using Trend Parameterization and ANSYS Mechanical

Lecture notes in mechanical engineering 2026

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Authors: Yunus Bin Othman, Tuan Mohamad Yusoff Shah bin Tuan Ya

DOI: 10.1007/978-981-95-6678-5_24

Cited by: 0

References: 3

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Engineering Applied Research Manufacturing Process and Optimization

References 3