Silver Sintered Packaging Optimization for Enhancing Short-Circuit Withstand Capability of Press-Pack IGBT Devices

Lecture notes in electrical engineering 2026

View at publisher

Authors: Pengbo Miao, Ganyu Feng, Xuebao Li, Chenran Jia

DOI: 10.1007/978-981-95-6837-6_19

Cited by: 0

References: 7

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Electronic Packaging and Soldering Technologies HVDC Systems and Fault Protection

References 7