Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

2026 Book

View at publisher

Authors: John Lau, Kuo‐Ning Chiang

DOI: 10.1007/978-981-95-6891-8

Cited by: 4

Fields of Study & Subjects

Copper Interconnects and Reliability 3D IC and TSV technologies Low-power high-performance VLSI design