A Study on Improving the Consistency of the Contact System in Half Size Relay Based on Optimal Stress-Relief Parameters of Ag-Mg-Ni Materials
Fields of Study & Subjects
Electrical Contact Performance and Analysis
Mechanical Engineering and Vibrations Research
Electronic Packaging and Soldering Technologies
Publication details
- Journal / source
- Lecture notes in electrical engineering
- Pages
- 558–567
- Publication date
- 1 January 2026
- Language
- EN