Investigation of Microchannel Heat Sink and Graphene-Based Heat Spreader for Thermal Management of 3D TSV Chip

Lecture notes in mechanical engineering 2026

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Authors: Harpreet Singh Whan, Amanpreet Singh Whan, Neeraj Kumar

DOI: 10.1007/978-981-96-8500-4_14

Cited by: 0

References: 16

Fields of Study & Subjects

3D IC and TSV technologies Thermal properties of materials Heat Transfer and Optimization

References 16