Study on the Structure and Properties of Microelectronic Packaging Materials

Springer eBooks 2026 Book chapter

View at publisher
Authors: Gang Wang, Yingfeng Yu
DOI: 10.1007/978-981-99-7346-0_15
Cited by: 0
References: 34

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Silicone and Siloxane Chemistry Advanced Materials and Semiconductor Technologies

Publication details

Journal / source
Springer eBooks
Pages
387–407
Publication date
1 January 2026
Language
EN
Document type
Book chapter