A homogenization method for thermo-mechanical stress analysis in printed circuit heat exchangers

Continuum Mechanics and Thermodynamics 2026

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Authors: Hao Wang, Lujun Cai, Fan Bai, Feng Zhang

DOI: 10.1007/s00161-026-01464-6

Cited by: 1

References: 41

Fields of Study & Subjects

Heat Transfer and Optimization Injection Molding Process and Properties Electronic Packaging and Soldering Technologies

References 41