Low-damage ductile removal of silicon carbide based on distributed undeformed chip thicknesses in composite ultrasonic vibration-assisted grinding (CUVAG)

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Authors: Zhi Sun, Chenwei Dai, Qing Miao, Zhen Yin, M. Zhang, Jiajia Chen
Cited by: 0
References: 40

Fields of Study & Subjects

Advanced machining processes and optimization Advanced Surface Polishing Techniques Advanced Machining and Optimization Techniques

Publication details

Journal / source
The International Journal of Advanced Manufacturing Technology
Volume
142
Issue
5-6
Pages
2703–2723
Publication date
1 January 2026
Language
EN