Metal micro-hole array processing technologies: research progress, challenges, and future perspectives

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Authors: Xin Ma, Qiang Shi, Yong Huang, Yaqi Liu, Qingyu Meng
Cited by: 2
References: 128

Fields of Study & Subjects

3D IC and TSV technologies Nanomaterials and Printing Technologies Microwave Engineering and Waveguides

Publication details

Journal / source
The International Journal of Advanced Manufacturing Technology
Publisher
Springer Science and Business Media LLC
Volume
142
Issue
9-10
Pages
4303–4327
Publication date
21 January 2026
Language
EN