Metal micro-hole array processing technologies: research progress, challenges, and future perspectives
Fields of Study & Subjects
3D IC and TSV technologies
Nanomaterials and Printing Technologies
Microwave Engineering and Waveguides
Publication details
- Journal / source
- The International Journal of Advanced Manufacturing Technology
- Publisher
- Springer Science and Business Media LLC
- Volume
- 142
- Issue
- 9-10
- Pages
- 4303–4327
- Publication date
- 21 January 2026
- Language
- EN