Causes and improvement measures of the lateral-burr defect in stamped power-semiconductor leadframes

The International Journal of Advanced Manufacturing Technology 2026 Open access

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Authors: Heng-Sheng Lin, Chuan-Hsi Hung, Ian Hu, Rui-Feng Chen, Jia-Wei Huang
DOI: 10.1007/s00170-026-17494-y
Cited by: 0
References: 22

Fields of Study & Subjects

Metal Forming Simulation Techniques Manufacturing Process and Optimization Powder Metallurgy Techniques and Materials

Publication details

Journal / source
The International Journal of Advanced Manufacturing Technology
Volume
143
Issue
1-2
Pages
281–297
Publication date
4 February 2026
Language
EN