Wafer grinding parameter designs with pre-designated wafer profiles

The International Journal of Advanced Manufacturing Technology 2026

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Authors: Tzu-Fan Chiang, Sheng-Min Guo, Wen-Nan Cheng, Chih-Chun Cheng, Chung-Yu Tsai
DOI: 10.1007/s00170-026-17701-w
Cited by: 0
References: 28

Fields of Study & Subjects

Advanced Surface Polishing Techniques Advanced machining processes and optimization Advanced Machining and Optimization Techniques

Publication details

Journal / source
The International Journal of Advanced Manufacturing Technology
Volume
143
Issue
5-6
Pages
3351–3367
Publication date
27 February 2026
Language
EN