A novel unified modeling of heat and moisture transport in a semiconductor containing spherical cavity

Acta Mechanica 2026

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Authors: Sudip Mondal, Abhik Sur

DOI: 10.1007/s00707-025-04618-w

Cited by: 3

References: 53

Fields of Study & Subjects

Thermoelastic and Magnetoelastic Phenomena Numerical methods in engineering Thermal properties of materials

References 53