Enhancing the Toughness of Epoxy Resin through Interface Strengthening via Chain Entanglement and Covalent Bonding

Chinese Journal of Polymer Science 2026

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Authors: Yu-Chen Wu, Yong-Peng Wang, Yong-Peng Wang, Meng-Zhu Liu, Haibo Zhang, De-Wu Song, Yilong Wang, Yilong Wang, Xiao Sun, Meng‐Xuan Wu, He-Xin Jing, Yulong Han
DOI: 10.1007/s10118-025-3538-9
Cited by: 2
References: 28

Fields of Study & Subjects

Epoxy Resin Curing Processes Synthesis and properties of polymers Polymer composites and self-healing

Publication details

Journal / source
Chinese Journal of Polymer Science
Publisher
Springer Science and Business Media LLC
Volume
44
Issue
3
Pages
869–881
Publication date
4 February 2026
Language
EN