Residual Stress Evolution in Dual-Diaphragm MEMS Microphones During Fabrication and Packaging Processes

Acta Mechanica Solida Sinica 2026

View at publisher

Authors: Hongjie Guo, Xinyu Wu, Qiuhong Liu, Zhiqiang Chen, Zhengjin Wang

DOI: 10.1007/s10338-026-00726-9

Cited by: 0

References: 28

Fields of Study & Subjects

Advanced MEMS and NEMS Technologies Acoustic Wave Resonator Technologies Mechanical and Optical Resonators

References 28