Phase-Field Modeling of Crack Propagation in Multilayer Thin-Film Structures for Electronic Packaging

Acta Mechanica Solida Sinica 2026

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Authors: Xinyi Luo, Xin Zhang, Yanwei Dai, Tao Wang, Haidong Fan, Peidong Li
DOI: 10.1007/s10338-026-00790-1
Cited by: 1
References: 36

Fields of Study & Subjects

Numerical methods in engineering Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies

Publication details

Journal / source
Acta Mechanica Solida Sinica
Publisher
Springer Science and Business Media LLC
Publication date
14 July 2026
Language
EN