Stress evolution characteristics of packaging structures with embedded piezoresistive sensors under thermal cycling loads

Acta Mechanica Sinica 2026

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Authors: Wenxing Chen, Yuexing Wang, Linwei Cao, Xu He, Xiangyu Sun, J.C. Qiao, Quanfeng Zhou

DOI: 10.1007/s10409-025-25124-x

Cited by: 0

References: 30

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Mechanical and Thermal Properties Analysis

References 30