Electro-mechanical-carrier coupling model in fractured piezoelectric semiconductor strip with vertical cracks
Fields of Study & Subjects
Numerical methods in engineering
Ultrasonics and Acoustic Wave Propagation
Composite Material Mechanics
Publication details
- Journal / source
- Applied Mathematics and Mechanics
- Publisher
- Springer Science and Business Media LLC
- Volume
- 47
- Issue
- 2
- Pages
- 347–368
- Publication date
- 1 February 2026
- Language
- EN
- Document type
- Book chapter