Electro-mechanical-carrier coupling model in fractured piezoelectric semiconductor strip with vertical cracks

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Authors: Cai Ren, Kaifa F. Wang, Baolin Wang
Cited by: 1
References: 58

Fields of Study & Subjects

Numerical methods in engineering Ultrasonics and Acoustic Wave Propagation Composite Material Mechanics

Publication details

Journal / source
Applied Mathematics and Mechanics
Publisher
Springer Science and Business Media LLC
Volume
47
Issue
2
Pages
347–368
Publication date
1 February 2026
Language
EN
Document type
Book chapter